Adhesives for Potting, Rigidizing applications Substrates: Circuit board, Electrical components

235

Adhesive Technologies

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Available Applicators: PRO100, PRO200, HD350, MT500, PT500, SP600 / EX600,

Quick Overview


    Heat Resistance:145ºF/63ºCViscosity at 350°F/177°C:12,000Shear tensile pine, psi:377Adhesion to Polycarbonate:97psiWorking time range:35-45 secondsAvailable forms:110, 210, 400, 500 150ºF/66ºC
    Viscosity at 350°F/177°C: 15000
    Shear tensile pine,
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Details

Formula 235 is a clear general-purpose hot melt capable of bonding many plastics and wood products as well as some polyolefins.

Additional Information

Manufacturer: Adhesive Technologies
For More Information on the Adhesives for Potting, Rigidizing applications Substrates: Circuit board, Electrical components, [Click Here] to Link to Manufacturer Web Site
 
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